RT 5880 PCB

RT 5880（https://www.ipcb.com/rfpcb/86.html） copper-clad laminates are usually fabricated by directly bonding Teflon components of the laminate to the surface of the foil. If electrodeposition is used, the spherical joint surface of ED foil will be mechanically interlocked with Teflon. Due to the thermal stability of RT / Duroid 5880 PCB, people seldom pay attention to the precise control of the welding process, but sometimes they encounter joint problems in the process of the solver. Especially in the assembly and rework process when using rough control of manual soldering tools.

iPcb designed an experiment to detect the effect of temperature on the bonding strength between the copper foil and RT / Duroid 5880 plate. The test sample is a 0.062 inch (1.59 mm thick) RT / Duroid 5880 laminate covered with 1 oz ft2 (34 mm thick) ed copper foil. In the experiment, the samples were exposed to a series of different temperatures (from 182 ℃ to 371 ℃). The sample consists of 1 / 8 inch (3 mm) wide copper wire with a 1 / 4-inch liner at one end. The copper wire and pad are etched on a 2-inch square laminate specimen.

Rogers 5880 PCB material is manufactured with the same high-quality, reliable materials and processes as Rogers, enabling Rogers to win important awards from high-frequency material manufacturers. In some designs, the dielectric properties of the PCB are critical. Whether it is a high-speed PCB, RF PCB, or microwave PCB, you will find that PCB prototypes require more PCB dielectric properties than standard FR-4 cannot provide. we know. This is why we use Rogers 5880 dielectric material. These new low-loss dielectric materials mean higher performance for demanding PCB prototypes.